The temperature change in the heating and refrigeration process and the chemical treatment process can cause the wafer carrier size to change, resulting in wafer scraping or rupture, the equipment correction time increases, and ultimately reduces the output and equipment productivity. It is essential for quality that the carrier particles produced at the contact point between the wafer and the carrier tooth will directly lead to wafer defects, which in turn will affect the wafer production, Engineers estimate that about 20% of foreign material defects are related to black powder produced by wafer carriers made of ordinary toner filling materials.

Compared with ordinary wafer carrier materials (such as polypropylene, PBT), PEEK polymeric materials are much more stable in size, have higher wear resistance to various surfaces and produce fewer particles, and PEEK polymeric materials can maintain stable physical properties in the continuous change of temperature. The research and analysis of wafer manufacturers show that the properties of PEEK polymeric materials are helpful to reduce the size change and foreign material problems. Thus, the output and the use efficiency of the equipment are improved.

Advantages:

1, excellent dimensional stability

2, good wear resistance

3, stable physical properties at different temperatures

4, high purity, no pollution.